IncWell's partner seeks robust encapsulation technology to protect printed circuit boards (PCBs).
Currently, electrical component cooling is accomplished with a thermal interface material (TIM) that resides between the electrical component and the substrate and/or coolplate. This TIM can be costly and is subject to decreasing effectiveness due to age and wear. Additionally, the coolplate itself can also increase the total thermal resistance of the unit.
In order to facilitate "direct" water/glycol cooling of PCBs and avoid usage of TIMs, IncWell's partner seeks a technology that can completely enclose the electrical component (such as VIAs, MOSFET, ICs, etc.) - see image below:
The encapsulating technology must tightly conform to the electrical component, be robust in nature (resistant to abrasion from coolant flow, thermal expansion, mechanical strain) and compatible with automative environments.
The successful technology will:
Additionally, IncWell's partner is primarily interested in solutions that are well developed (TRL = 7).
Potential approaches include (but are not limited to):
When responding to this request, please be sure to provide a non-confidential description of the technology you propose along with information regarding your alignment with the Key Success Criteria as well as your desired business relationship with IncWell's partner.