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High Density Power Inverter

Request Number N270917
Need details
Description

Consumers are increasingly expecting more complex technology in their automotive experiences while at the same time government performance standards require increasing fuel economy, resulting in a concurrent demand for better, more efficient, more lightweight power sources.

 

In order to meet this pressing demand, IncWell's partner is seeking novel high density power inverter technology.

 

Background

The design and partitioning between the central processing unit (CPU) and the power electronics as well as the available printed circuit boards (PCB) have significant impacts on the cooling requirements and overall size in addition to the time and cost to produce each high density power inverter.

 

A system of integrated CPU and power electronics result in conflicting PCB requirements. As the number and rate of CPU signals increase, so do the required routing layers while the power electronics require high thermal conductivity and sufficient heat-spreading to the cooling system in order to avoid thermal damage during operation.

 

IncWell’s partner seeks high density power inverter technology making use of new materials, new internal configurations, novel cooling systems or combinations of all three for usage in modern automotive environments.

 

Key Success Criteria

IncWell's partner seeks a high density power inverter with a minimum TRl of 4-5. A proof-of-concept prototype is desired by year's end.

 

The successful technology will be capable of:

  • Input voltage: 48 VDC
  • Output Current: 800A (rms), 3 phases for BLDC (up to 2kHz rotary field frequency)
  • Output Power: 20kW
  • PCB Design Space Dimensions:
    • ~cylindrical shape
    • ~160mm diameter
    • ~50mm height 
  • Low system cost
  • Coolant Inlet Temperature: 85°C (if watercooled)
  • Ambient temperature: -40 to 150°C
  • High reliability (automotive application)

 

Possible Approaches

Potential approaches for this project include, but are not limited to:

  • Combined approach of existing (FR4) and new PCB technologies (e.g. Flex-PCB, IMS, DCB, …)
  • Alternative connector technologies (e.g. Board to Board Bonding, IC Lead Frame, Bare Die, …)
  • Efficient cooling concepts (e.g. substrate integrated, immersion or spray cooling) to enable maximum power at minimum design space and cost
  • Combinations of above technologies

 

Approaches not of interest
None.
Preferred Collaboration types
  • To Be Negotiated
Items to be submitted

When responding to this request, please be sure to provide a non-confidential description of the simulation technology you propose along with information regarding your alignment with the Key Success Criteria as well as your desired business relationship with IncWell's partner.

 

Point of Contact
Jonathan Jakischa
Area of Interest
  • Electronics & Electronic Components
  • Electrical Products
  • Electronic Component Manufacturing
  • Energy & Power Production
  • Alternative Power Generation
  • Other
  • Manufacturing & Fabrication
  • Original Equipment Manufacturers
Organization
IncWell
Due Date
January 15, 2018
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