Siemens Process Instrumentation is seeking a Multi-Sensor Node which is ready for ATEX Zone 1 with a flexible architecture design. The aim is to address the emerging new markets based on IIoT (Industrial Internet of Things) in the process automation. This involves monitoring and optimization of already installed assets in the brownfield, for example by services based on predictive maintenance.
The IoT based approach to provide digital services based on sensor data is already proven in various markets. In the process automation field this concept gives way for new business models. We see a high potential with a strong growing market in this business field and identified a large amount of use cases with various requirements for the sensor node in the field. For the market entry we want to address several use cases at the same time. Therefore we are looking for a Multi-Sensor Node with a flexible architecture to meet the different requirements of these use cases.
Key success Criteria
The Multi-Sensor Node has to fulfil the following criteria (prioritized from most important to less important):
The architecture of the sensor node has to be flexible in terms of:
different radio modules must be provided (e.g.: radio modules with the same footprint / flexible antenna design)
usage of different power supplies (integrated battery or wired from external)
support of different interfaces to external sensors ( at least: 1x analog - 16bit sampling on board; 1x SPI; 1x I2C)
Preprocessing of raw data within the sensor node is required. MCU with RTOS and a computation power comparable to an ARM Cortex-M3 or better.
A minimal lifetime with battery module (typical 3,5 Ah): 5 years @ listed temperature range and a use case with the main sleeping time of the sensor node
wake up every minute for measuring and sending the data (30kbyte) once per day
ATEX Zone 1 ready design
Operating temperature range: at least: -20 up to 60°C ; ideal: -40 up to 80°C
The integrated sensors should provide the best possible physical coupling to the asset to be installed:
accelerometer / vibration sensor with a minimal bandwidth of 3kHz should provide a rigid coupling to the mounting interface
the temperature sensor should provide a coupling with a high thermal conductivity
Siemens Process Instrumentation (PD PA PI) is seeking for a full solution as well as a partner for joint development. In the case of a joint development the existing design of the sensor node has to fulfill the first 3 above mentioned criteria.
Approaches not of Interest
All solutions which do not meet the first above mentioned criteria.
Items to be submitted
We are looking for concise, non-confidential proposals. The proposal should:
Describe the technical approach
Provide information on the performance of the technology (if available)
Include a description of the responding organisation or team and their experience.
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Preferred Collaboration Types
To Be Negotiated
Area of Interest
Engineering-Computer > Digital Circuits
Engineering-Computer > Digital Communications and Networking
Engineering-Computer > Signal Processing
Manufacturing > Electrical equipment
Engineering-Electrical > Electrical and Electronics
Engineering-Electrical > Instrumentation
Engineering-Electrical > Sensors
Engineering-Electrical > Sensors Engineering
Engineering-Electrical > Electrical and Electronics > Digital Electronics
Engineering-Electrical > Electrical and Electronics > Instrumentation
Information and Communication > Information services > Data processing, hosting and related activities
Engineering-Electrical > Sensors > Electric Current Sensors
Engineering-Electrical > Sensors > Electric Potential Sensors