requests-for-proposal

Development Partner for Highly Thermal-Conductive and Insulating Material with Good Formability

Request Number REQ8339918
Due Date April 7, 2017
Author Seh-Rin Sung
Request for Proposal Details
RFP Title
Development Partner for Highly Thermal-Conductive and Insulating Material with Good Formability
RFP Description

NineSigma, representing a major material manufacturer, seeks a joint partner to develop high thermal conductivity and electrically Insulating resin with good formability.

Background

Thermal management based on thermal-conductive resin materials has become a crucial problem with increasing the density of integrated devices such as light-emitting diodes, power semiconductors, and other electronic components. Generally, to improve the thermal conductivity of a resin material, inorganic filler materials with high thermal conductivity are added to the resin. However, since there are trade-offs among high thermal conductivity, high insulation performance, and molding/laminating formability, it is difficult to keep these advantages in composite materials. The client has developed thermally conductive electrically insulating organic materials, but has not succeeded in developing the resin materials having such target performance.

 

Currently, research and development for highly thermal-conductive and insulating materials are globally ongoing. The client has issued this open request to further accelerate its development in collaboration with potential partner.

 

 

Key Success Criteria

We welcome proposals based on traditional approach such as improving base resin structures and filler dispersion as well as developing new innovative materials.

 

Ultimate Goal

  • Thermal conductivity (in thickness direction, as composite material):
    • Minimum 12 W/mK by 2018
    • Minimum 20 W/mK by 2020
  • Withstand voltage Minimum 5 kV at 100-μm thickness
  • Molding formability: Highly formable
    • Can be formed into film shape or usable as liquid prepolymer

   Film requirements

  • Thickness: Maximum 200 μm
  • Has flexibility
  • Preferred Molding method: Compression molding, vacuum lamination, or vacuum pressing

Details of the required technology

The anticipated technologies to meet the ultimate goal are:

  • Improvements for base resin (thermosetting resin) structure
    • Currently, the client uses epoxy resin-based materials, but will study the use of other thermosetting resin.
  • Improvements for filler shape and structure
  • Filler orientation
  • Improvements to compatibility and wetting between resin and fillers
  • New materials

Anticipated Project Phases or Project Plan

The client will review submitted proposals and possibly ask clarifying questions before selecting the most suitable candidates for collaboration. The client will select the best candidate(s) through evaluations. During the selection process, the client may execute non-disclosure agreements (NDA) with selected respondent(s), seek further information disclosure, and discuss specific development targets or potential opportunities.

The client will execute necessary agreement(s) with the selected respondent(s) and move to the advanced development phase. Specifics of any collaboration will be determined through consultation with the concerned parties.

 

 

Possible Approaches

Anticipated approaches include, but are not limited to, the following:

  • Improvements for base resin structure
    • Resin having structure that allows easier filler orientation
    • Addition of oriented polymer
  • Higher filler performance
    • Improved filler shape, and hybrid fillers
    • Highly thermal-conductive carbon fillers with insulating coatings
  • Filler dispersion
    • Reduced interfacial thermal resistance by filler surface treatment
    • Secured thermal conductive path by filler orientation
  • New materials
    • Graphene oxide based material, boron nitride nano-sheet material, etc.

 

Approaches not of interest

The following approaches are not of interest:

  • Approaches using injection molding
  • Approaches to add filler highly on thermoplastic resin alone

 

Preferred Collaboration types
Items to be submitted

Responses should use the Proposal Template which is linked to the “attachments“ shown at the bottom of this page and include the following items:

  • Category of technology
    • Material (base resin, filler, or other)
    • Dispersion technology (surface treatment, filler orientation, or other)
  • Overview of the proposed technology (advantages, principles)
  • Uniqueness of the technology
  • Development stage (performance verified at a lab level/prototype developed/implemented for practical use)
  • Current Performance
    • Material
      • Thermal conductivity
      • Withstand voltage performance (electrical resistivity)
      • Molding formability (thickness, flexibility)
    • Dispersion technology
      • Target materials
      • Improved physical properties
      • Application examples
  • Current challenges and future development plans
  • Past achievements (additional information indicating R&D capabilities, such as research papers and patents)
  • Organization overview

 

Area of Interest
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