Resin with Low Thermal Conductivity and High Thermal Stability

Request Number REQ6338047
Due Date April 10, 2017
Author Seh-Rin Sung
Request for Proposal Details
RFP Title
Resin with Low Thermal Conductivity and High Thermal Stability
RFP Description

NineSigma, representing a leading multi-billion dollar manufacturer, seeks resin with low thermal conductivity and high thermal stability.


The client aims to develop a new product using high-temperature heat source. To make maximum use of the heat source, the client is planning to use resin with low thermal conductivity and high thermal stability. However, a material with such properties is yet to be realized.


Meanwhile, R&D activities to control the thermal conductivity have been widely conducted around the world to expand the range of resin applications. Therefore, in order to utilize such related technologies for its further development, the client has issued this open request.



Key Success Criteria

Anticipated proposals are not only for materials already satisfying the required properties, but also for those currently under a research and development stage.


Final requirements of the anticipated resin

  • Thermal conductivity: 0.1 W/m·K or lower
  • Heat deflection temperature: 330°C or higher
  • MFI: 4.5 g/10min or more
  • Flexural modulus: 4000 MPa or more
  • Shrinkage factor: 1% or less


The client places utmost importance on the thermal conductivity and the thermal stability (heat deflection temperature) in this request. Therefore, as long as a material is potentially to achieve the requirements on the thermal properties through additional development of 2 years, we welcome proposals even though all the requirements are not satisfied at this stage.

Possible Approaches

Anticipated approaches include, but are not limited to, the following:

  • Reduce thermal conductivity of plastic materials with high thermal stability
    • Porous structure
    • Making composites with fillers with low thermal conductivity
  • Improve the thermal stability of plastic materials with low thermal conductivity
    • Improved crystallinity
    • Organic-inorganic hybrid materials

Other applicable approaches are also welcomed.



Approaches not of interest

The following is not of interest:

  • An idea or a concept of material without any verification



Preferred Collaboration types
Items to be submitted

Items to be Included in the Proposal

Responses will use the Proposal Template which can be downloaded from the “attachments” shown at the bottom of this page and include the following items:

  • Details of the proposed material
    • Overview
    • Uniqueness
    • Successful applications
    • Development stage (performance verified in lab / under development for practical use / already implemented in practical use)
  • Current performance
    • Thermal conductivity
    • Heat deflection temperature
    • MFI
    • Flexural modulus
    • Shrinkage factor
  • Availability of samples, and conditions if available (NDA/period/cost, etc.)
  • Current challenges and future development plans to meet the ultimate requirements

Please download the Proposal Template from "Actions" on "Attachments" at the bottom of this page.

Area of Interest
Request Priority