The client aims to develop a new product using high-temperature heat source. To make maximum use of the heat source, the client is planning to use resin with low thermal conductivity and high thermal stability. However, a material with such properties is yet to be realized.
Meanwhile, R&D activities to control the thermal conductivity have been widely conducted around the world to expand the range of resin applications. Therefore, in order to utilize such related technologies for its further development, the client has issued this open request.