Computers and electronics have become commonplace additions to almost all aspects of life. PCB’s have been designed to withstand all but the harshest of environments. NineSigma’s client designs, develops, and manufactures passive microwave circuits that operate in very challenging thermal and structural environments. They seek materials and manufacturing techniques to expand to higher temperature regimes while remaining cost effective.
The deadline for this RFP has been extended due to a number of inquiries from Solution Providers asking for more details. In order to assist all interested solution providers, the most frequently asked questions and their associated answers are included below:
Q. What kind of substrate materials are desired?
A. A low-loss substrate material that is relatively constant across frequency. Dielectric Constants less than 10 are preferable.
Q. How many multi-layers of dielectric material are needed?
A. Up to 3 conductive layers are anticipated. A minimum of one outer surface will need a conductive layer.
Q. The range of temperature (1200-2500°F) is too broad. To meet the requirement of “Survive long term exposure (> 1hr) at 1200 – 2500 °F”, the minimum condition of 1hr at 1200 °F is enough to test? What is the maximum temperature? What do you mean by the “long term exposure”? Did you consider the temperature of 2500°F is very close to the melting point of most of metals?
A. We are investigating multiple uses that could fall into the 1200-2500°F range. A material does not have to meet the 2500° requirement but would need to be at least 1200° to be of interest. However, the higher the better.
Q. What is the detail requirement for heat loads?
A. A rough estimate would be about 30,000 BTU/hr-ft2
Q. We have a lot of experience in development of dielectric materials and printed circuit boards. Would you give us some examples of conductive materials to refer for this application?
A. We need conductivities that are normally associated with metals (copper, gold, platinum), however we are interested in anything that can survive the heat and still allow highly detailed patterns to be printed.
Q. How many conductive layers are needed? Only one face, both faces, or one/both faces plus internal layers? If more than one layer, must there be a “via” technology for connecting them electrically from one layer to another?
A. Up to 3 conductive layers are anticipated. A minimum of one outer surface will need a conductive layer. Vias are not needed at this time but we would like to know if the technology has any challenges with vias.
Q. Is it necessary that either or both faces of the patterned PCB have an unobstructed “view” to the environment, or could one or both faces be covered with an electrically insulating or conducting material (provided any conducting material is electrically insulated from the pattern on the PCB)?
A. Both sides will require an unobstructed view to the environment.
Q. Is there a link available to the existing product for which the high-temp version is being developed? Is the photo shown reflective of the actual product?
A. No, unfortunately we do not have an existing product to reference, and the picture in the RFP is not an actual product.