requests-for-proposal

High Temperature Printed Circuit Board (PCB) Construction

Request Number REQ0315069
Due Date August 22, 2016
Author Paul Musille
Request for Proposal Details
RFP Title
High Temperature Printed Circuit Board (PCB) Construction
RFP Description

NineSigma, representing a Global Manufacturing Company, invites proposals for innovative techniques to produce high temperature printed circuit boards (PCB’s).

Background

Computers and electronics have become commonplace additions to almost all aspects of life.  PCB’s have been designed to withstand all but the harshest of environments.  NineSigma’s client designs, develops, and manufactures passive microwave circuits that operate in very challenging thermal and structural environments.  They seek materials and manufacturing techniques to expand to higher temperature regimes while remaining cost effective.

 

 

PLEASE NOTE: 

The deadline for this RFP has been extended due to a number of inquiries from Solution Providers asking for more details. In order to assist all interested solution providers, the most frequently asked questions and their associated answers are included below:

 

Q. What kind of substrate materials are desired?
A.  A low-loss substrate material that is relatively constant across frequency.  Dielectric Constants less than 10 are preferable.

 

Q. How many multi-layers of dielectric material are needed?
A. Up to 3 conductive layers are anticipated. A minimum of one outer surface will need a conductive layer.

 

Q. The range of temperature (1200-2500°F) is too broad. To meet the requirement of “Survive long term exposure (> 1hr) at 1200 – 2500 °F”, the minimum condition of 1hr at 1200 °F is enough to test? What is the maximum temperature? What do you mean by the “long term exposure”? Did you consider the temperature of 2500°F is very close to the melting point of most of metals?
A. We are investigating multiple uses that could fall into the 1200-2500°F range.  A material does not have to meet the 2500° requirement but would need to be at least 1200° to be of interest.  However, the higher the better.

 

Q. What is the detail requirement for heat loads?
A. A rough estimate would be about 30,000 BTU/hr-ft

 

Q. We have a lot of experience in development of dielectric materials and printed circuit boards. Would you give us some examples of conductive materials to refer for this application?
A. We need conductivities that are normally associated with metals (copper, gold, platinum), however we are interested in anything that can survive the heat and still allow highly detailed patterns to be printed.

 

Q. How many conductive layers are needed?  Only one face, both faces, or one/both faces plus internal layers?  If more than one layer, must there be a “via” technology for connecting them electrically from one layer to another?
A. Up to 3 conductive layers are anticipated. A minimum of one outer surface will need a conductive layer.  Vias are not needed at this time but we would like to know if the technology has any challenges with vias.

 

Q. Is it necessary that either or both faces of the patterned PCB have an unobstructed “view” to the environment, or could one or both faces be covered with an electrically insulating or conducting material (provided any conducting material is electrically insulated from the pattern on the PCB)?

A. Both sides will require an unobstructed view to the environment.


Q. Is there a link available to the existing product for which the high-temp version is being developed? Is the photo shown reflective of the actual product?
A. No, unfortunately we do not have an existing product to reference, and the picture in the RFP is not an actual product. 

Key Success Criteria

The successful technology will:

  • Apply conductive, high complexity patterns, to a multi-layer dielectric material
  • Survive long term exposure (> 1hr) at 1200 – 2500 °F
  • Minimize electrical and structural changes due to increased heat loads
  • Structure does not outgas under thermal load
  • Technology must be economical to produce on a large scale
    • Circuit sizes (24”x24”)
  • Volume ~ 100 per month

 

Possible Approaches

Possible approaches might include, but are not limited to:

  • Heat resistant conductive and dielectric materials
  • Novel manufacturing schemes facilitating the adherence of temp stable conductive materials to carbon ceramic matrix material, or other temperature stable dielectric materials

 

Preferred Collaboration types
Items to be submitted

Your response should address the following:

  • Non-confidential description of proposed technology including:
    • Temperature stability
    • Structural performance
    • Expected mechanical tolerances on the printed patterns
    • Expected dielectric properties across the largest frequency band possible
  • Method of application, processing, or construction
  • Technical maturity of the approach (concept, prototype, ready to commercialize, commercialized)
  • Pathway to commercial scale including timing, estimated budget, and capacity for manufacture
  • Position on intellectual property including patent references
  • Desired relationship with sponsor
  • Team description and related experience

 

Appropriate responses to this Request

 

Responses from companies (small to large), academic researchers, other research institutes, consultants,  entrepreneurs, or inventors are welcome. For example:

  • You represent a company or university that has demonstrated a proof of concept.
  • You represent a company or university that has a product ready to incorporate into customer applications.
  • You represent a university research department that has a bench-scale demonstration ready to adapt.
  • You represent a university research department that has an undeveloped pathway with a high probability of success.

 

 

Area of Interest
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